10 Aug
2008
10 Aug
'08
5:11 p.m.
On 10 Aug 2008 at 13:05, Brent Hilpert wrote:
Not definitive as to when the DIP was first
introduced, but a couple of datapoints:
- 1965 TI catalog shows only flatpacks
- 1966 Fairchild catalog shows flatpacks, round cans (metal and epoxy),
and 14 and 16-pin DIP packages.
The DIP packages are also referred to as being "plug-in packages".
From:
http://www.hbci.com/~wenonah/history/edpart6.htm
"For both linear and digital ICs, packaging problems had to be
overcome. Transistor packages were found to lack sufficient
heat-sinking capability and an adequate number of interconnections.
One solution was the flatpack, created by Yung Tao while at Texas
Instruments. The original flatpack had 10 leads, and measured 1/4 x
1/8 inch. In 1964 Fairchild's Bryant ("Buck") Rogers fostered. the
invention of the dual-inline package. The original DIP had 14 leads,
and looked just as it does today. The same year, Martin LepSelter of
Bell Labs invented the beam lead as a mechanical and electrical
interconnection between the IC and its case."
Cheers,
Chuck