24 Feb
2014
24 Feb
'14
1:10 p.m.
On 02/24/2014 12:37 PM, Terry Stewart wrote:
Well, there you go, but it strikes me as some pretty sloppy engineering.
You really need the cover to make firm contact with the top of the
cerDIP package. This looks like it uses a generous glob of the stuff to
fill in the obvious gaps.
It might have been better to use a separate firmly-attached heatsink or
at least some sort of spring clip to make contact with the IC package.
--Chuck