16 Jan
2017
16 Jan
'17
12:06 p.m.
On 01/16/2017 11:26 AM, Brian Walenz wrote:
I've also started reflowing and adding fresh
solder before attempting
to desolder. Could be better heat transfer, or just easier to suck
up a larger blob.
On a veneered and generated board like one from a PDP-8, I'd probably
use a fusible alloy, such as Chip-Quik and avoid elevated temperatures
altogether.
--Chuck