8 Apr
2010
8 Apr
'10
8:18 p.m.
On 4/8/10 7:06 AM, "dwight elvey" <dkelvey at hotmail.com> wrote:
Hi
In most cases, I find that heating from one side and sucking
from the other works fine, even for ground planes.
If I can get the solder to melt at all, it always clears this
way.
As another mentioned, if it only has a little solder in
it, you need to add solder to fill the hole before sucking.
Solder wick is almost impossible to use in such cases
without damaging the board ( too many heat sinks ).
Dwight
With all the component harvesting I've been doing lately, I have a hakko 808
sedoldering gun and a hot air rework station that I use to desolder chips
and other components.