3 Jun
2012
3 Jun
'12
11:12 a.m.
On 6/3/12 10:57 AM, William Donzelli wrote:
If he does not clean up the pins, the solder joints
will be
suboptimal
All of the ICs are socketed using TI sockets. You aren't going to get the oxidation
to match at the point where the IC sticks out of the socket. You aren't very likely
to
find the right solder mask, or get it to exactly match the machines that can easily be
examined at CHM. I have actually compared the two we currently have, and it would be
easy to detect a forged third board.