12 Jan
2014
12 Jan
'14
6:21 p.m.
On Jan 12, 2014, at 12:48 PM, Philip Pemberton <classiccmp at philpem.me.uk> wrote:
...
I do have a solder paste template for the board, working pick-and-place
system and convection reflow oven... they were purchased after the last
assembly house tried to screw me over (50% jump in NRE costs between
quoting and placing the order, followed by a demand that I sent an extra
ten spare FPGAs "just in case" which they were unwilling to return if
unneeded).
For those who can puzzle out German, here is a nice article about an inexpensive reflow
oven kit, and the writer?s experience putting it to work.
http://www.beta-estore.com/download/rk/RK-10001_76.pdf
I haven?t done BGA work, so up to now I?ve done my surface mount assembly with a soldering
iron, but I may change that next time; soldering 0.5 mm lead pitch TSSOP packages by hand
is not particularly comfortable.
paul