23 Jan
2012
23 Jan
'12
4:57 a.m.
On 01/22/2012 11:29 PM, Chuck Guzis wrote:
It's pretty easy to do that with vias.
-Dave
--
Dave McGuire
New Kensington, PA
I can probably
deal with QFPs, but BGAs are just nasty, particularly
when combined with the wrong sort of solder.
My thought was that they'd be able to do the same trick, where each
contactl on the BGA would settle into its own solder-filled recess
and all you'd have to do is heat the area. But maybe not...