9 Nov
2011
9 Nov
'11
11:17 a.m.
On Wed, Nov 9, 2011 at 1:29 PM, Chuck Guzis <cclist at sydex.com> wrote:
On 9 Nov 2011 at 13:13, Dave McGuire wrote:
I worked with the old VGA chipsets with 208 qfp packages when they were the
rage. I would pre-coat the pads with some no clean flux solder, not much,
just enough to make a connection. Then squirt some liquid flux across the
pads - using the bottle w/needle applicator. Position the chip, using the
corner pins as alignment - and tacking them with the iron. And then I would
lightly press on the rest of the pins with a blade tip, about 4/5 pins at a
time. Never any solder bridges or solder-wick cleanup needed.
=Dan
Ahh yes. Dragging?
Yup, with the broadest chisel tip that I have. Cleanup with a bit of
solder wick. Works like a charm.