In message <5.1.0.14.2.20060605135056.0408cb08 at mail.30below.com>
Roger Merchberger <zmerch-cctalk at 30below.com> wrote:
Why not get wire-wrap sockets that have longer tails,
and put a toothpick
or popsicle stick under the socket when you solder it (with enough room to
remove it later), then it will give enough room to solder the top as well,
thereby bridging both layers. Sure, it's a little more labor, but can &
does work... Granted, if you were working in a very limited height
scenario, one might need to be careful with the extra height.
Another way - get a piece of wirewrap wire (well, I guess Roadrunner wire
would be better, but w/w should work) and strip the insulation off of it. Put
it through the hole and bend it over in a "U" shape. Solder the top side down
to the track and cut off the excess wire. Then when you solder the socket in,
solder the wire to the bottom side too (I usually wrap the wire round the
socket's pin first). Cut off the excess wire. There you go - a through hole
connection. That trick is usually pretty handy when you desolder something
and some of the through-hole plating eyelets end up pulling out with the pin.
[[ I have no knowledge of audio/analog circuit shiznit
WRT stuff like
that.... ]]
Me neither... I've got some basic analogue skills (mostly related to using
opamps for VERY basic signal processing) but ask me to make a transistor
audio amplifier and I'm lost...
I do however know a lot of the little 'thou shalt not break this rule' type
stuff - one decoupling capacitor of between 10nF and 100nF between Vcc and
ground as close to the power pins on the IC as possible, and so forth.
Anyway, reseating chips isn't that difficult of a
"fix" anyway...
Well it beats replacing unsocketed chips any day. Swap-in/swap-out vs.
cut pins off/desolder/clean holes/install new chip/clean more
holes/install/solder/resolder the pad you missed....
:)
--
Phil. | Kitsune: Acorn RiscPC SA202 64M+6G VF+UniPod
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