25 Feb
2014
25 Feb
'14
3:13 a.m.
On 02/24/2014 04:10 PM, Chuck Guzis wrote:
On 02/24/2014 12:37 PM, Terry Stewart wrote:
Well, there you go, but it strikes me as some pretty sloppy
engineering. You really need the cover to make firm contact with the
top of the cerDIP package. This looks like it uses a generous glob of
the stuff to fill in the obvious gaps.
It might have been better to use a separate firmly-attached heatsink
or at least some sort of spring clip to make contact with the IC package.
--Chuck
The problem is they have a cover over it and it contained the heat
unless you copled the heat source to the cover.
The base chips in air have no need for a heat sink.
The TI990/4 mini was more expensive because it had peripheral of
substance and more ram, way more.
Everyone seems to forget RAM was costly at one time.
Allison