The problem with BGA work/rework is to make sure the IC sits on the
right position while you apply heat.
I did a revolution on Xbox360 repair with that: You can use
"positioners" made from silicon rubber, the same pink type you use on heat
spreaders or processors heatsink. You cut a square on one of the corners and
put it on the corners of the chip to stop it from moving. So you can apply
heat.
---
Enviado do meu Motorola PT550
Meu site:
----- Original Message -----
From: "David Riley" <fraveydank at gmail.com>
To: "General Discussion: On-Topic and Off-Topic Posts"
<cctalk at classiccmp.org>
Sent: Sunday, January 12, 2014 9:27 PM
Subject: Re: "A DiskVaccuum For Obsolete Disk Formats"
On Jan 12, 2014, at 18:05, Ryan Brooks <ryan at
hack.net> wrote:
On 1/12/14, 12:21 PM, Paul Koning wrote:
I haven?t done BGA work, so up to now I?ve done my surface mount
assembly with a soldering iron, but I may change that next time;
soldering 0.5 mm lead pitch TSSOP packages by hand is not particularly
comfortable.
We're probably in a similar "place". When hand soldering a tssop or tqfp
sort of thing and it is going great, it is great. When it goes bad, it
is really bad, and sometimes I've ruined a board trying a repair.
I have since tried reflow, manually managing the temp (using a
thermocouple on the board, and having done some test runs to understand
the toaster oven) and it is more consistent. It seems a little
magical, which can be scary.
I haven't 100% switched over, but I think I will. I'd love to hear that
someone is having success with bga with toaster reflow.
I did toaster oven reflow on QFP with reasonable success
(just a minor cleanup pass with braid), but I probably could
have gotten away without the cleanup pass if I had
known to use extra flux. It's been a while.
I recently got a hot air rework station off eBay, though, and
I'm excited to try it out with BGAs (the whole reason I
got it, aside from the fact that it was under $200). I'll
gladly report back once I have some anecdotal data points.
- Dave