12 Jan
2014
12 Jan
'14
11:27 p.m.
On Jan 12, 2014, at 18:05, Ryan Brooks <ryan at hack.net> wrote:
I did toaster oven reflow on QFP with reasonable success
(just a minor cleanup pass with braid), but I probably could
have gotten away without the cleanup pass if I had
known to use extra flux. It's been a while.
I recently got a hot air rework station off eBay, though, and
I'm excited to try it out with BGAs (the whole reason I
got it, aside from the fact that it was under $200). I'll
gladly report back once I have some anecdotal data points.
- Dave
On 1/12/14, 12:21 PM, Paul Koning wrote:
I haven?t done BGA work, so up to now I?ve done my surface mount assembly with a
soldering iron, but I may change that next time; soldering 0.5 mm lead pitch TSSOP
packages by hand is not particularly comfortable.
We're probably in a similar "place". When hand soldering a tssop or tqfp
sort of thing and it is going great, it is great. When it goes bad, it is really bad, and
sometimes I've ruined a board trying a repair.
I have since tried reflow, manually managing the temp (using a thermocouple on the board,
and having done some test runs to understand the toaster oven) and it is more consistent.
It seems a little magical, which can be scary.
I haven't 100% switched over, but I think I will. I'd love to hear that someone
is having success with bga with toaster reflow.