26 Oct
2005
26 Oct
'05
4:22 p.m.
On Wed, 26 Oct 2005 15:50:45 -0400, Tim Shoppa wrote:
Brent wrote:
> Across the history of ICs, DIP packaging begins to look like a
> 25-to-30-year sidebar.
I like the way "flip chip" (not just the
term, but the concept) is coming
back into vogue, forty years after DEC registered it as a trademark.
Tim.
From: http://tarr.uspto.gov/servlet/tarr?regser=serial&entry=72200706
U.S. Class: 026 (International Class 009)
ELECTRONIC CIRCUIT MODULES OF THE PLUGABLE TYPE, CONTAINING ELECTRONIC COMPONENTS MOUNTED
ON CIRCUIT BOARDS AND CONNECTED TO CONDUCTORS
FORMED THEREON, AT LEAST ALL BUT ONE OF THE CONNECTIONS BETWEEN THE COMPONENTS AND
CONDUCTORS BEING ON SURFACES OTHER THAN SURFACES OF
SAID COMPONENTS CONTACTING THE BOARDS
First Use Date: 1964-08-24
Abandoned: 1987-03-06
Is this an early description of what we know today as surface mount ?
or an early description of the Controlled Collapse Chip Connection,
or C4 (C4) process used by Monolithic Systems Technology MST,
introduced in 1968 formally by IBM ?
Some pictures of the inside of a MST chip can be found here.
http://www.ibm-collectables.com/gallery/view_album.php?set_albumName=album86
Sure looks like a modern flip-chip just way bigger in those days.
Good ideas can manifests themselves in many ways and applications.
Bob Bradlee