)
but I have no idea what to use or how to go about this.
Terry (Tez)
On Mon, Jan 13, 2014 at 12:05 PM, Ryan Brooks <ryan at hack.net> wrote:
On 1/12/14, 12:21 PM, Paul Koning wrote:
On Jan 12, 2014, at 12:48 PM, Philip Pemberton
<classiccmp at philpem.me.uk>
wrote:
...
I do have a solder paste template for the board,
working pick-and-place
system and convection reflow oven... they were purchased after the last
assembly house tried to screw me over (50% jump in NRE costs between
quoting and placing the order, followed by a demand that I sent an extra
ten spare FPGAs "just in case" which they were unwilling to return if
unneeded).
For those who can puzzle out German, here is a nice article about an
inexpensive reflow oven kit, and the writer?s experience putting it to work.
http://www.beta-estore.com/download/rk/RK-10001_76.pdf
I haven?t done BGA work, so up to now I?ve done my surface mount assembly
with a soldering iron, but I may change that next time; soldering 0.5 mm
lead pitch TSSOP packages by hand is not particularly comfortable.
We're probably in a similar "place". When hand soldering a tssop or
tqfp
sort of thing and it is going great, it is great. When it goes bad, it is
really bad, and sometimes I've ruined a board trying a repair.
I have since tried reflow, manually managing the temp (using a
thermocouple on the board, and having done some test runs to understand the
toaster oven) and it is more consistent. It seems a little magical,
which can be scary.
I haven't 100% switched over, but I think I will. I'd love to hear that
someone is having success with bga with toaster reflow.
Ryan