On Thursday 15 June 2006 09:59 pm, Ethan Dicks wrote:
Any idea as to
why that should fail so often?
Thermal death? It's a bi-polar part, not *MOS, and it does run hotter
than the rest of the components.
Somewhere, probably buried pretty good in my storage unit, are a whole mess
of heatsinks. I'd bought them figuring that it might be good to add them to
some of the chips in those machines, but the idea never went anywhere.
These are the kind that slip over (and under!) the chip, and would probably
do a better job than the silly metal shield that they put over some of those
boards, which was still better than the cardboard that some of them used.
Even when they punched holes in that cardboard for ventilation they still
couldn't get it right as what little ventilation there was in the bottom of
the case couldn't get past the cardboard, and the bits that were punched out
were sometimes not removed, but would instead fall on the board and short
things out.
--
Member of the toughest, meanest, deadliest, most unrelenting -- and
ablest -- form of life in this section of space, a critter that can
be killed but can't be tamed. --Robert A. Heinlein, "The Puppet Masters"
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Information is more dangerous than cannon to a society ruled by lies. --James
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