From what
I've seen, this is caused by the copper and the base material
expanding and
shrinking at different rates. It is seen quite a bit where
temperature ranges between extremes, especially with cheap and older stuff.
No. The differences in expansion just are not that big. If you do the
math, you will see that the dimensional changes of the the two
disimilar substances just are not that big - way too small to cause
all sorts of wrinkles. At worst case, maybe *a* wrinkle would show up
on a long trace.
The expansion was a problem with early surface mount chip designs,
however. Here the dimensional tolerances were/are tiny, so the little
swings could cause breaks in the connections. This is why there is a B
in BGA - the little balls raise the package above the board and act as
little moment arms to flex during temperature shifts.
I'm told this is one big reason why PCB's were
not accepted for military and
space-grade stuff for quite some time before they managed to more closely match
materials' thermal expansion coefficients.
No. It is almost all due to bureaucratic inertia. The military is
funny this way - sometimes a new technology will be scooped up as soon
as served, yet others they drag their feet with.
And of course, in the 1950s and 60 all the contractors were making a
mint, charging the government for all that hand wired work. They were
not about to change to a cost saving new idea.
--
Will