Perhaps I am just weird, but I rarely damage circuit
boards or components
when de-soldering.
You do not know it, but you are.
ICs, and to a lesser extent transistors, are made to be soldered
*once*, and in a well controlled heated environment. Heating up an IC
pin often will stress the die and introduce cracking in the silicon,
as the chip expands in a non-uniform manner. Most of the time these
microscopic cracks do not immediately kill the device, but they will
reduce the expected lifetime of the chip. Basically, the reliability
plummets due to these "latent failures" caused by thermal stress.
If you need to desolder an IC for reuse, the best thing to do is to
mimic the action of the machines that stuffed the boards in the first
place. Heat up the entire device gently with a heat gun set on low, so
the entire die expands more or less uniformly. Even just raising the
chip temperature 30 degrees C over ten or twenty seconds will help
immensely. And when the device is removed, let it cool naturally,
--
Will