There is
also another circuit board mounted underneath the one with
the EPROMs that contains lots of other chips: M74LS22P, M74LS08P x 2,
HD14002BP, M74LS00P, M74LS138P, M74LS02P, MC14013B, MC14011B.
Ouch! A lot more logic than I was expecting (I was hoping it was
just an
address decoder mapping the ROMs into one of the gaps in the HHC's
memory
map). This would appera to be some kind of paging circuit (you've
got a
couple of D-type flip-flops there that could be used to hold the
selected
bank number).
Hmmm... Sounds like that makes it unlikely that it would be possible
to just burn the 16k of code into two 8k EPROMs that will fit inside
the HHC. I suppose I could find a 6502 disassembler and try to figure
Well, the internal ROMs -- the user-installable ROMs -- are bank-switched
too, I think. There are 3 outputs from the I/O controller (custom chip).
One of them selects between {a} all acessses to a particular area going to
the I/O devices and {b} write accesses going to the I/O stuff and reads
going to the ROMs. The other 2 lines are decoded by half a '139 to select
between the ROMs (3 internal sockets, one signal on the expansion
connector for one (or is it several, with external bank select logic) ROM
in an add-on unit.
But I would be suprised if the SNAP development ROMs would work without
changes in the internal sockets.
Also on the HHC, I've discovered that the display really is 159 columns
of dots. There are 4 driver chips, each of them can drive 40 columns. The
160th 'column' is the 8 annunciators across the bottom of the display.
out how the code works so that it could be patched to
work in ROMS
inside the case. Anyone want to recommend a good 6502 disassembler?
The 6502 instruction set is so small that it's easy to write a
disassembler...
-tony