19 May
2010
19 May
'10
8:13 a.m.
On 18 May 2010 at 8:04, John Robertson wrote:
That won't work for edge connectors - it would
disintegrate under
contact wiping and/or pressure. Particularly if the pad is passing any
current (power rails).
I don't understand why this would be the case. Copper is copper,
whether it's foil glued on or electroplated.
Heck, during the 80's, PCBs that were *all* electrodeposition (no
etching) were widely produced. An electroless copper process formed
the base, which was then electroplated to the desired thickness. PCB
vias are still formed this way.
Thickness isn't an issue--whole parts are sometimes produced by
electrodeposition of copper, far greater than the thickness of the
foil used in PCBs.
Can you offer a cite or some rationale as to why electrodeposited
copper is inferior to foil?
Chuck