24 Jan
2013
24 Jan
'13
1:51 p.m.
On Thu, 24 Jan 2013, David Riley wrote:
On Jan 24, 2013, at 4:29 PM, geneb <geneb at
deltasoft.com> wrote:
"Dice" is the plural of "die" in the semiconductor industry as much
as
it is elsewhere. Or, at least, I've seen it repeatedly used as such
in industry publication. The word "dies" is incorrect for small
objects cut in a regular pattern from a larger one (as opposed to dies
used for casting) as far as I know, but it's a fairly widespread error
in semiconductor discussions.
I'll have to remember that, thanks!
g.
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Back in
the day, I heard the FPU was "disconnected" with laser-drilled
holes on dice that failed FPU testing, then the package was labelled
to match. To be clear, a wafer was made up of dice that were intended
to be sold as 486DX chips but failed FPUs (and most likely enough ones
with good FPUs to cover customer demand) were pierced.
Dice? Do you mean "dies" maybe?