3 Aug
2004
3 Aug
'04
1:06 p.m.
On Tue, 3 Aug 2004, Tony Duell wrote:
BGAs are probably easier than QFPs. All you need is a hot air gun and a lot of
flux... The only problem is that if you mess up, you lose the chip (assuming
you dont have a re-baller or send the chip out to be re-balled), and have to
remove it and start over.
I've done 516,388,and 256 ball standard (.050" pitch) and 48 ball chip scale
(.0315" pitch) parts with very good success rate with nothing more than a
$59.00 hot air gun (and some practice)
Another problem with most modern stuff is that it is
surface mount tiny "you can't work on it without
special tools" not meant for repair, only for replacement.
The only problem with working on surface mount stuff is that people think
it's hard. It's not.
As for special tools, yes, a hot-air soldering tool is useful (but one of
those butane-powered irons with the hot air tip is OK for repairs). But I
just used a normal soldering iron with the finest bit made, and take a
little care. I've done PQFPs, SOICs, transistors, passives, etc with no
problem at all.
Now BGAs are a problem (I wonder what the cheapest setup for doing those
is -- I've seen a protoryping rig, but it's about \pounds 5000). But
components where you can get to each individual connection are no trouble
at all.
-tony
Peter Wallace