10 Apr
2010
10 Apr
'10
6:03 p.m.
Chuck Guzis wrote:
When done badly, as in the Xbox "Red Ring of
Death", failure results.
When done well with careful design, RoHS BGA work is probably quite
durable.
I do wonder if half the problem is heat... the Xbox360 CPU and GPU were
well known to be incredibly power-hungry (moreso than other CPUs and
GPUs in their class) and put out a lot of heat. Couple that with a
piss-poor cooling system...
Heat + RoHS solder = increase in brittleness?
Or we get into the hairy business of thermal expansion and contraction
again... heat up, cool down, heat up, etc. I wonder how the coefficient
of expansion compares between RoHS solder (say, SnAgCu) and 60:40 SnPb?
--
Phil.
classiccmp at philpem.me.uk
http://www.philpem.me.uk/