My plan was to ramp it up to 400F in an oven,
soak for 5 mins, then cool
down to minimize thermal issues. Does this sound good?
Is 400 degrees anywhere
close to hot enough?
I can't see why this is an issue. The needed data has been published by
the vendors
WRT reflow soldering and specifically BGA reflow soldering.
The required temperatures are in the 210-220degree C range (420-430
degree F).
There is a recommended temperature profile for this. the total time
start to cool down is about 400
seconds with the high temperature
portion less than
200 seconds. See Lattice BGA Solder Reflow and Rework Recommendations
ap note.
Modst BGA part use a lower melting temp material to keep the active
device in the
comfort range (under 250C peak).
The favorite hobby/small shop tool for this is the small counter top
"Toaster Ovens" with an
external temperature control.
Allison