The expansion coefficients may be have a relatively
small delta but it is enough
given enough time, enough temp cycling and enough of a temp range.
Why would the time and number of cycles be of concern? The materials
are going to expand so much, then contract right back where they
started. If they shrank (maybe due to a cold cycle), I can see some
cases with some stretching of the copper that would permanently change
the dimensions (and even there - the copper may never be stretched
into the plastic area). With a heating cycle, any deformations are
going to be pulled right out when the contractions occur due to
cooling. And if there is a wrinkle, any additional deformations to the
metal from cycling are going to be at that wrinkle, as the copper has
been weakened at that point. There will be no "incentive" for the
copper to wrinkle elsewhere. And how many deep (as in solder machine
temperature) cycles? I hope only one, or all your parts are going to
be at the bottom of the chassis.
Thermal expansion of materials is generally not a cumulative property.
And with some "back of the napkin" calculations, running an inch long
copper trace thru a solder machine is going to make it expand less
that five thousandths more than the substrate - that's not much.
Probably not even enough for a single wrinkle.
--
Will