Which DEC machine made use of th pre Flip-Chip board?

Al Kossow aek at bitsavers.org
Fri Dec 21 17:26:23 CST 2018

yea, that was it


I didn't know we had this example in the collection, they were
hybrids like IBM SLDs

Do you know of any module part numbers that used them?

On 12/21/18 2:40 PM, William Donzelli wrote:
>> The original "Flip Chip" was a packaging failure. It was literally a die bonded to a PCB
>> and never went into production.
>> I think it is mentioned in "Computer Engineering"
>> IBM perfected the techniques to do this later with the development of solder bumps and
>> IR reflow.
> Are you talking about the little black rectangles, sort of SIP
> packages, DEC tried in the late 1960s? They were a disaster with
> reliability, but they did ship.
> --
> Will

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