Which DEC machine made use of th pre Flip-Chip board?

[Al Kossow]

yea, that was it

http://www.computerhistory.org/collections/catalog/XD37.80

I didn't know we had this example in the collection, they were
hybrids like IBM SLDs

Do you know of any module part numbers that used them?


On 12/21/18 2:40 PM, William Donzelli wrote:
>> The original "Flip Chip" was a packaging failure. It was literally a die bonded to a PCB
>> and never went into production.
>>
>> I think it is mentioned in "Computer Engineering"
>>
>> IBM perfected the techniques to do this later with the development of solder bumps and
>> IR reflow.
> 
> Are you talking about the little black rectangles, sort of SIP
> packages, DEC tried in the late 1960s? They were a disaster with
> reliability, but they did ship.
> 
> --
> Will
>