Which DEC machine made use of th pre Flip-Chip board?

[William Donzelli]

> The original "Flip Chip" was a packaging failure. It was literally a die bonded to a PCB
> and never went into production.
>
> I think it is mentioned in "Computer Engineering"
>
> IBM perfected the techniques to do this later with the development of solder bumps and
> IR reflow.

Are you talking about the little black rectangles, sort of SIP
packages, DEC tried in the late 1960s? They were a disaster with
reliability, but they did ship.

--
Will