Which DEC machine made use of th pre Flip-Chip board?

[William Donzelli]

They use the same R and S numbers, just late revision suffices. I have
a machine made with them that sometimes even works. I have a bunch
that have had the gold fingers peeled off (don't blame me - I got them
this way).

--
Will
On Fri, Dec 21, 2018 at 6:26 PM Al Kossow <aek at bitsavers.org> wrote:
>
> yea, that was it
>
> http://www.computerhistory.org/collections/catalog/XD37.80
>
> I didn't know we had this example in the collection, they were
> hybrids like IBM SLDs
>
> Do you know of any module part numbers that used them?
>
>
> On 12/21/18 2:40 PM, William Donzelli wrote:
> >> The original "Flip Chip" was a packaging failure. It was literally a die bonded to a PCB
> >> and never went into production.
> >>
> >> I think it is mentioned in "Computer Engineering"
> >>
> >> IBM perfected the techniques to do this later with the development of solder bumps and
> >> IR reflow.
> >
> > Are you talking about the little black rectangles, sort of SIP
> > packages, DEC tried in the late 1960s? They were a disaster with
> > reliability, but they did ship.
> >
> > --
> > Will
> >
>