Stuffing boards with pulled QFP chips
Jon Elson
elson at pico-systems.com
Sat Apr 1 12:03:25 CDT 2017
On 04/01/2017 11:19 AM, Chuck Guzis via cctalk wrote:
> BGA, on the other hand, is something that I haven't
> mastered--and I doubt that I ever will, given the small
> size of some of the parts.
Yes, I'm with you. if I get bad soldering on a leaded
flat-pack, I can poke the leads with an X-acto knife to find
the ones that wiggle, and then touch up the soldering and
test again. With a BGA or leadless package, there's no easy
way to detect or fix bad soldering.
Jon
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