Reproduction micros

[Paul Koning]

> On Jul 21, 2016, at 7:07 PM, Liam Proven <lproven at gmail.com> wrote:
> 
> ...
>>  They're all plastic pin grid array
>> packages.  No heatsink at all.  Nor does the datasheet for the PQFP show
>> anything related to a heatsink.  It also shows a PLCC version; no heatsink
>> there either, and again I've never seen one.  Maybe that's just because I
>> normally only saw them in Acorn machines, of course.
> 
> You seem to misunderstand my remark about heatsinks.
> 
> It is also possible that I am misusing the term "PQFP" but I have
> attempted to confirm it with Google image searches and I think it's
> what I meant.
> ...
> Is that not a PQFP chip? A flat plastic package with pins on all 4 sides?

PLCC and PQFP both are plastic packages with leads on all 4 sides.  But PLCC specifically means a package with J-leads: the legs come out the package side, go straight down, and tuck under the package in a J-shaped curve.  PQFP (and variations with similar acronyms) have "gull wing" leads: out the side, down to near the board, and then outward resting on the board.

SA110 is definitely PQFP.  Here's a PLCC for comparison:

http://www.batronix.com/images/products/chips/PLCC32-500-330.jpg

PLCCs have fairly limited lead counts; they were common for 44 lead packages, and perhaps a bit more.  PQFP goes well over 100, especially in the "fine pitch" ones with lead pitch under 1 mm.  (Pain in the *** to solder...)  Beyond what those can do, or for extra small packaging, we get BGA -- ball grid array.

	paul