Stuffing boards with pulled QFP chips

[Chuck Guzis]

On 03/31/2017 06:15 PM, Jon Elson via cctech wrote:

> I have a project I do from time to time using 128-lead 14mm TQFPs
> with 0.4mm lead spacing. I use a stereo zoom microscope with a
> home-made LED ring light. First, I rub the pads with a pencil eraser
> to remove oxidation caused by reflow temps on the rest of the board.
> I put a tiny dab of solder on two pads at opposite corners. I then
> place the chip in place and reflow those pads.  If the alignment is
> not good enough, I can "walk" the chip a bit by reflowing one, then 
> the other pad.  Then, I apply liquid flux to the rows of leads with
> a wire dipped in the flux. And, then solder down the rows with a
> fine-tip soldering iron.  If a bridge develops, solder wick fixes
> it.

There are plenty of good Youtube videos describing this.  I use pretty
much the same method, but start off with just a binocular loupe and then
finish with a stereo microscope for final inspection.

The soldering  iron tip that works best for me is a rather broad chisel
tip.  I leave the fine tips for other work.

--Chuck