TK50/TK70 Info

[Jon Elson]

On 08/29/2015 01:01 AM, Mark J. Blair wrote:
>> On Aug 28, 2015, at 19:46, Jon Elson <elson at pico-systems.com> wrote:
>>
>> Then, the only problem is the temp variation across the size of the oven, which can be considerable.
> I'm thinking that air circulation should be helpful to reduce hot spots, whether I'm baking boards or media. I expect that I'll get a much better understanding of how my layout affects things like tombstoning once I reflow my own boards. I've designed many a board, but other than ones I've hand soldered myself with irons, they've all been assembled out of sight and out of mind from me.
>
Tombstoning is actually quite rare when using good solder 
paste. I've done thousands of boards, had a fair share of 
head-in-pillow and plain solder failure, but maybe just 6 
actual tombstones. Probably the slow temperature ramp with 
the toaster oven helps avoid this.

Jon