TK50/TK70 Info

Jon Elson elson at
Sat Aug 29 10:13:18 CDT 2015

On 08/29/2015 01:01 AM, Mark J. Blair wrote:
>> On Aug 28, 2015, at 19:46, Jon Elson <elson at> wrote:
>> Then, the only problem is the temp variation across the size of the oven, which can be considerable.
> I'm thinking that air circulation should be helpful to reduce hot spots, whether I'm baking boards or media. I expect that I'll get a much better understanding of how my layout affects things like tombstoning once I reflow my own boards. I've designed many a board, but other than ones I've hand soldered myself with irons, they've all been assembled out of sight and out of mind from me.
Tombstoning is actually quite rare when using good solder 
paste. I've done thousands of boards, had a fair share of 
head-in-pillow and plain solder failure, but maybe just 6 
actual tombstones. Probably the slow temperature ramp with 
the toaster oven helps avoid this.


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