elson at pico-systems.com
Sat Aug 29 10:13:18 CDT 2015
On 08/29/2015 01:01 AM, Mark J. Blair wrote:
>> On Aug 28, 2015, at 19:46, Jon Elson <elson at pico-systems.com> wrote:
>> Then, the only problem is the temp variation across the size of the oven, which can be considerable.
> I'm thinking that air circulation should be helpful to reduce hot spots, whether I'm baking boards or media. I expect that I'll get a much better understanding of how my layout affects things like tombstoning once I reflow my own boards. I've designed many a board, but other than ones I've hand soldered myself with irons, they've all been assembled out of sight and out of mind from me.
Tombstoning is actually quite rare when using good solder
paste. I've done thousands of boards, had a fair share of
head-in-pillow and plain solder failure, but maybe just 6
actual tombstones. Probably the slow temperature ramp with
the toaster oven helps avoid this.
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